5000 楔焊键合机

特点

·       7 英寸触摸显示屏

·        双核CPU 硬件系统

·        Windows CE基础的软件管理

·       USB 扩展能力, 可外接鼠标,键盘, 存储盘

·       可在存储盘上存储和导入焊线配置文件

·       800MB 存储能力

·       MPP 焊线配置文件数据库

·       在线的操作手册指南

·       模拟操作套件可选

·       内部工具文件

·       Z方向操作可选手动或半自动控制

·       5.3英寸X5.3英寸大焊接区域

·       尾丝微调及一致性控制

·       深腔焊接扩展能力

·       Z轴直流伺服运动闭环控制

·       PLL锁相环超声波发生器及高Q值换能器

·       内置温控系统

·       不同的显微镜及辅助光标系统可选

·       可处理焊线种类：金线，铝线，金带及铜线

·       焊接类型：楔焊焊接，连续焊接，金带焊接 

·       鼠标及Z轴操控轴可灵活设置在左手或右手位置

·       自动再送线系统

FEATURES

·       7” TFT Touch Screen Management

·       Cortex A9 Dual-Core CPU-based hardware system

·       Windows CE-based management software

·       USB connectivity - External Mouse, Keyboard, Disk on Key

·       Load/Store wire bonding profiles, Disk on Key backup

·       800MB Capacity

·       MPP Bonding profiles internal library

·       On-Line Manual

·       Analog Pots Kit Optional

·       Internal Tools database

·       Semi-automatic/manual mode with Z option

·       Designed for aluminum wire, gold wire, ribbon and copper

·        Large 5.3” X 5.3” bonding area

·       Consistent tail length with fine adjustment on panel

·       Deep Access capability

·       Z-axis DC servo motion with closed loop control

·       Phase Locked Loop (PLL) ultrasonic generator and high-Q transducer

·       Built-in temperature controller

·       Wide range of microscopes and optical accessories available

·       RoHS Compliant

·       Chessman/Mouse & Manual Z convertible right or Left

·       Bonding Types: Wedge, Tab, Stitch and Ribbon

·       Advanced Wedge Automatic Wire Re-Feed